Current

2007/2008

Layer Count, Maximum

36

40

Board Thickness

0.245"

0.250"

Mechanical Drilling

Pad Diameter, External (D=Drill Dia.)

Pad Diameter, Internal (D=Drill Dia.)

Plane Clearance (D=Drill Dia.)

0.0059"

(0.0035" + Min A/R)*2 + D

(0.0055" + Min A/R)*2  + D

(0.007" + Min Space)*2  + D

0.0059"

(0.0030" + Min A/R)*2  + D

(0.0050" + Min A/R)*2  + D

(0.0065" + Min Space)*2  + D

Plating Aspect Ratio
(Board Thickness/Drill Diameter)

14:1

16:1

Line/Spacing, External
Line/Spacing, Internal

4 mils / 4 mils
3.0 mils / 3.0 mils

3 mils / 3.5 mils
2.5 mils / 2.5 mils

Surface Finish

Hot Air Solder Level (HASL)
Electroless Ni Imm. Gold (ENIG)
Immersion Silver
Hot Oil Reflow
IR Fused
Selective Solder Strip
Electrolytic Ni/Gold

Hot Air Solder Level (HASL)
Electroless Ni Imm. Gold (ENIG)
Hot Oil Reflow
IR Fused
Selective Solder Strip
Electrolytic Ni/Gold

Surface Finish, Subcontract

Immersion Tin,
Electroless Bondable Soft Au
Electrolytic Gold (Soft)
OSP
Immersion Silver
Lead Free HASL

Immersion Tin,
Electroless Bondable Soft Au
Electrolytic Gold (Soft)
OSP
Immersion Silver
Lead Free HASL

Build-Up Multilayers

Blind Via
Buried Via
uVia

Blind Via
Buried Via
uVia

Solder Mask Registration

± 0.002" Auto-Alignment

± 0.0015" Auto-Alignment

Solder Masks

LPI
Dry Film
Screened

LPI
Dry Film
Screened
LDI

Current

2007/2008

FR-4

Nelco N4000-29
Nelco N4000-6
Nelco N4000-7
Isola ED 130
Isola 402
Arlon 55NT (Thermount)
1755

Nelco N4000-29
Nelco N4000-6
Nelco N4000-7
Isola ED 130
Isola 402
Arlon 55NT (Thermount)
1755

Polyimide

Arlon -35N, 33N
Arlon 85NT (Thermount)

Arlon -35N, 33N (V0)
Arlon 85NT (Thermount)

High Speed Materials

GETEK
Rogers 4003C
Rogers 4350B
Rogers 4403
Rogers 4450B
PTFE (2 sided)
Nelco N4000-13

GETEK
Rogers 4003C
Rogers 4350B
Rogers 4403
Rogers 4450B
PTFE (2 sided)
Nelco N4000-13

Other

Copper Invar Copper
Aluminum Core

Copper Invar Copper
Aluminum Core

Laser Micro-Vias:
Blind-to-1 Layer Down
Micro-Via Diameter (D)
Capture Pad Diameter (Outer)
Target Pad Diameter (Inner)

0.004" minimum
D + 0.008"
D + 0.008"

0.003" minimum
D + 0.006"
D + 0.006"

Via Fill

Conductive and Non-Conductive Paste

Conductive and Non-Conductive Paste
Plated Cu uVia Fill

Characteristic Impedance
(Single Ended)

36-100, ±10%

36-100, ±8%

Differential Impedance

Edge Coupled
Broad-Side Coupled
50-140

Edge Coupled
Broad-Side Coupled
50-140

Continuity Resistance
Voltage
Test Point Density

10
10 to 1000V
300 / in (Grid)
580 / in (Split Net Grid)
1400+ / in Flying Probe

10
10 to 1000V
300 / in (Grid)
580 / in (Split Net Grid)
1400+ / in Flying Probe

ISO 9001:2000, AS9100

Certified

Certified

U.L. Listing

UL-94 V0 Listed on FR-4
UL Polyimide

UL-94 V0 Listed on FR-4
UL Polyimide (V0)

MIL-PRF-55110F, NHB 5300.4(3I)

On QPL-55110 for Material
Types GF, GI, and BI

On QPL-55110 for Material
Types GF, GI, and BI
MIL-PRF-31032
MIL-PRF-55110G

Implementation
Chemical Process Control
Laboratory Process Control
Cleanliness Controls

Computer Based
Yes
Yes
Yes

Computer Based
Yes
Yes
Yes