Materials
  • FR4, 4101/24/26
  • Polyimide, Thermount
  • GETEK
  • Rogers 4003
  • Copper Invar Copper
  • Aluminum Core
Finishes
  • Hot Air Solder Level (HASL)
  • Electroless Ni Imm. Au (ENIG)
  • Immersion Silver
  • Hot Oil Reflow
  • IR Fuse
  • Selective Solder Strip
  • Electrolytic NI/Gold
Other Services
  • Heat Sink Lamination
  • Terminal Hardware Capabilities
  • Milling, Counter Sink, Counter Bore
  • Hole Fill Application - Conductive and Non Conductive
  • QTA Service

  • Quality
  • ISO Certificate
  • ISO 9001:2000/AS 9100:2001 Quality Management Systems
  • MIL-PRF-55110F for material types GF (FR-4), GI (Polyimide), and
    BI (Polyimide Thermount®)
  • Listed by Underwriter’s Laboratories for:
    • 0.003 inch line width and spacing
    • 6 inch unpierced plane area
    • Up to 130C maximum operating temperature
    • 94-VO flammability rating on both FR-4 and polyimide materials
  • Product is built to the following industry specifications:
    • IPC-6011 and IPC-6012
    • NHB 5300 (3I

  • Engineering and IT
  • CAM
  • Photo

Inner Layer Printing
Tamaracks Model IGIC Collimated light source printers. Process capability of .003 mil. Line and space, through the DES process.
Lamination
Burkle LAM V Hot oil press system with two six opening hot presses and one six
opening cold press. Full automation from lay-up to breakdown. Thermal heating oil unit insuring the best in uniform thickness across the panel. Standard thickness variation +- .0015 mils
Drilling
Excellon Century 2001 6 spindle drills. Micro via through hole capability down to
.006 mils.
ESI UV YAG laser drill- .003 micro via laser technology, resin coated foil single ply constructions. Aspect ratio 1:1
Outer Layer Printing
Olec AT 30 Accutray Autoalign Imaging Platform Four camera, semi automatic fiducial registration system.
Screening
Dek ELA screen printer- Used for Non conductive and conductive hole fill process. Capability .006 through hole micro via with an aspect ratio of 14:1 Teledyne DSA-2000 Solder mask spay coater.
Plating
Pal automatic plating line with 6 copper stations, 1 Tin and 1 Solder station. DC plate and reverse pulse plate capabilities. Aspect ratio 14:1.
Inner Layer Facilities
  • Inner Layer Printing
  • Inner Layer Wet Process
  • Automated Optical Inspection (AOI)
  • Laminating
  • Maintenance Department
Outer Layer Facilities
  • Shearing
  • Drilling
  • Outer Layer Printing
  • Plating
  • Wet Process
  • Screening
  • Fabrication
  • Electrical Test
  • Chemical and Microsection Laboratory
  • Assembly
  • Inspection
  • Shipping

  • 11126 Bren Road West, Minnetonka, MN  55343
    Toll Free: 1-800-362-3303
    voice: (952) 933-3303  fax: (952) 933-2383
  • Sales e-mail: sales@holaday.com
  • Sales Representatives
    Butch Chayer – Director Sales and Marketing
    952-988-8055
    Sheila Steffen – Sales Engineer
    952-988-8023
    Tim Larson – Sales Engineer
    952-988-8024
  • Customer Service
    Lisa Keil  – Customer Service
    952-988-8062
  • Purchasing Department
  • Joan Karner – Director of Purchasing
    952-988-8032
  • Independent Sales Representatives
    Diversified Sales Solutions
    Powell, Ohio
    614-799-9220
    Mike Maitino - (614) 286-3786

    FSI Friedman Sales, Inc.
    Farmington, CT
    Steve Friedman – 860-677-4511


11126 Bren Road West
Minnetonka, MN 55343
1-800-362-3303

©2003 Holaday Circuits, Inc.
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