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2010 |
2011 |
2012 |
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Line/Spacing, External |
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4.0 mils / 4.0 mils |
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3.0 mils / 3.5 mils |
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Line/Spacing, Internal |
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3.0 mils / 3.0 mils |
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2.5 mils / 2.5 mils |
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Pad Diameter, Internal (D=Drill Dia.) |
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(0.0055" + Min A/R)*2 + D |
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(0.0050" + Min A/R)*2 + D |
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Pad Diameter, External (D=Drill Dia.) |
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(0.0035" + Min A/R)*2 + D |
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(0.0030" + Min A/R)*2 + D |
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Plane Clearance (D=Drill Dia.) |
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(0.007" + Min Space)*2 + D |
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(0.0065" + Min Space)*2 + D |
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Plating Aspect Ratio |
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10:1 |
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12:1 |
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14:1 |
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Materials being developed |
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Embedded Capacitance |
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Arlon 91ML |
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Arlon 99ML |
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DuPont Interra |
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Gore SPEEDBOARD C |
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Isola FR406HR |
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Isola FR408HR |
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Isola IS620 |
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Isola IS680 |
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Isola P96 & P26 |
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Micro Foils (8 microns) |
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Ohmega Ohmega-Ply |
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Rogers LCP |
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Zeta Lam |
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Laser uVias |
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.9:1 aspect ratio |
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.003 Dia |
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.007"
Capture Pad Dia (Outer) |
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.007"
Target Pad Dia (Inner) |
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Staggered |
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Stacked |
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Cu uVia
Fill |
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260C Tg
Non-conductive uVia Fill |
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Non-conductive uVia Fill |
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Surface Finish |
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Hot Air Solder Level (HASL) |
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Electroless Ni Imm. Gold (ENIG) |
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Hot Oil Reflow |
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IR Fused |
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Selective Solder Strip |
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Electrolytic Ni/Gold |
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Electrolytic Hard Ni |
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Carbon Ink |
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Selective Finishes |
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Electroless Bondable Soft Au |
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Electrolytic Gold (Soft) |
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OSP |
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Immersion Silver |
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Lead Free HASL |
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Solder Masks |
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LPI |
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Dry Film |
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Screened |
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LDI |
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Certifications |
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ISO 9000:200 |
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AS9100:2001 |
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NADCAP |
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MIL-PRF-31032 |
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MIL-PRF-55110G (GF, GI) |
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NHB 5300.4(3I)
Space Product |
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Testing |
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Raw Materials |
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IST (IPC TM 2.6.26) |
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Assembly Reflow Simulation (2.6.27) |
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Lamination Tg |
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Solder Purity |
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Copper Purity |
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Elongation / Tensile Strength |
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Monthly Group B Testing |
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Thermal Stress Testing |
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Ionic Cleanliness |
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SIR (Surface Insulation Resistance) |
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Standard Volume Technology |
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Limited Volume Technology |
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Developmental Technology |
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