|
Mechanical Drilling |
Standard |
Advanced |
|
Min Drill Size |
0.008 |
0.0059 |
|
Hole Location Tolerance |
> .006 DTP |
.003-.006 DTP |
|
Hole Tolerance: |
|
|
|
Plated |
-0.003 |
+-.0025 (+-.002 ENIG) |
|
Press-Fit (after Cu plate) |
-0.0025 |
-0.002 |
|
Non-Plated |
-0.002 |
-0.001 |
|
vias |
+.003 / -(hole size) |
|
|
Controlled-Depth Back Drilling |
+/- .005 |
+/- .002 |
|
Hole to Etched Feature (drill to pad) |
.004 DTP |
.002-.004 DTP |
|
|
|
|
|
Laser Drilling |
Standard |
Advanced |
|
Min hole size |
0.006 |
0.004 |
|
Microvia pad sizes |
.011/.012 |
.010/.011 |
|
Blind-to-1 Layer Down |
Yes |
|
|
Blind-to-2 Layer Down |
|
Yes |
|
Aspect Ratio |
.5:1 |
>=.6:1 |
|
Build Up Technology (IPC-2226 5.2) |
1C1 |
2C2 |
|
|
|
|
|
Hole Fill |
Standard |
Advanced |
|
Non-Conductiive |
Yes |
|
|
Conductive |
Yes |
|
|
Resin Fill |
Yes |
|
|
Plated Shut uVia |
Yes |
|
|
|
|
|
|
Cu Plating |
Standard |
Advanced |
|
Thru-Holes |
Class 2,3 & 3A |
|
|
Blind vias |
Class 2,3 & 3A |
|
|
Buried vias |
Class 2,3 & 3A |
|
|
Microvias |
Class 2,3 & 3A |
|
|
Plasma Etchback |
Yes |
|
|
|
|
|
|
SolderMask |
Standard |
Advanced |
|
Registration |
± 0.002" |
± 0.0015" |
|
Dams and Webs (green) |
0.003 |
0.0025 |
|
Dams and Webs (colors) |
0.0035 |
0.003 |
|
min Clearance/Coverage on AW |
.003 / .004 |
.002 / .003 |
|
|
|
|
|
Nomenclature |
Standard |
Advanced |
|
White (Ink Jet) |
0.008 |
0.006 |
|
Available Colors Yellow, Black, and Red |
0.008 |
0.008 |
|
Etched (based on Cu weight) |
see line width |
see line width |
|
|
|
|
|
Fabrication |
Standard |
Advanced* |
|
Hole to Routed Edge |
± .005 |
< ± .005 |
|
Hole to Adjacent Etched Feature |
± .0085 |
< ± .0085 |
|
Min Routed Radius |
0.016 |
.008 for thin panels |
|
Milled Edges/Controlled-Depth Milling |
± .005 |
± .002 |
|
Bevel |
Yes |
|
|
Countersink |
Yes |
|
|
Counterbore |
Yes |
|
|
* = Vision system alignment |
|
|
|
|
|
|
|
Electrical Test |
Standard |
Advanced |
|
Characteristic Impedance |
25-100Ω |
|
|
(Single Ended) |
±10% |
< ±10% |
|
Differential Impedance |
Edge Coupled |
|
|
|
Broad-Side Coupled |
|
|
|
50-140Ω |
|
|
|
10Ω |
<10Ω Ω |
|
Isolation |
10 M |
|
|
Voltage |
10 to 1000V |
|
|
Test Point Density |
300 / in2 (Grid) |
|
|
|
580 / in2 (Split Net
Grid) |
|
|
|
1400+ / in2 Flying
Probe |
|
|
HiPot |
500V |
1000V |
|
|
|
|
|
Quality Systems |
Standard |
Advanced |
|
IPC 600, 6011, 6012, 6016, 6018 |
Class 2,3 & 3A |
|
|
MIL-PRF-31032 |
Certified |
Certified |
|
MIL-PRF-55110 |
Certified |
Certified |
|
NHB 5300 (N.A.S.A.) |
Certified |
Certified |
|
ISO 9001:2008/AS9100:2009 |
Certified |
Certified |
|
AS9100 |
Certified |
Certified |
|
U.L. Listing |
UL-94 V0 |
|
|
Statistical Process Control: |
|
|
|
Implementation |
Computer Based |
Computer Based |
|
Chemical Process Control |
Yes |
Yes |
|
Laboratory Process Control |
Yes |
Yes |
|
Cleanliness Controls |
Yes |
Yes |